2017 is a transition year.
Storage Class Memory applications have gained a lot of publicity with Intel/Micron Announcement of 3d Xpoint/Optane. Resistive RAM from Crossbar, Inc and WDC and 4DS and others has similar cost structure and potentially better physics, scalability, and performance.
We look at how ReRam technologies compare to SLC NAND/Fast NAND, DRAM, 3D XPoint, and how the costs scale over time with new geometries. Key Takeaways:
- 3d Xpoint and Optane are creating new markets for everyone. Customers want choices
- All technologies are cheaper than DRAM with any reasonable maturity
- Fast NAND/ZNAND is available today and while not new or as fast, it is based on SLC 3D NAND which is quite mature
- Crosspoint ReRam is cheaper than 3D Xpoint once scaled to 20/14nm and has ability to scale lower
- ReRam technologies can be integrated into foundries with relatively minor changes. Intel Micron has reports "100 new materials in 3D Xpoint"
- Crossbar, Inc ReRam is available at foundry today. 4DS showed data with performance and yield on demonstration vehicles. WDC has said ReRam is SCM of choice
- Fast speed, 1M cycles, competitive cost is achievable today from ReRam.
See our presentation at Flash Memory Summit, Wednesday 8/9 at 3:20 PM. Session 203A to find out how competitive ReRam is.